Quick-Quote Portals
 
              Design for Manufacturability
WEQ (Web Express Quote)
Send files FTP files
  • Capabilities
   

Annular Ring

Standard

Emerging Technologies

Internal Minimum Pad Size

.016” larger than finished hole size.

.014” larger than finished hole size w/tear drop.

External Minimum Pad Size

.016” larger than finished hole size.

.014” larger than finished hole size w/tear drop.

* increase pad size accordingly for annular ring requirements greater than .001”.

* holes requiring greater than .001” copper (i.e. 2oz. Base plated to 4oz. Finish) require an additional .004” pad diameter

Plane Layer Clearance

 

 

PTH & NPT hole Clearance to Plane

.030” larger than finished hole size.

.024” larger than finished hole size.

PTH & NPT hole to I/L Trace

.015” spacing

.012” spacing

 

 

 

Line Width & Space

 

 

I/L Line Width on 1 oz. Base Copper or Less

.005” standard

.004”

I/L Line Width on 2 oz. Base Copper

.008” minimum

.008” minimum

I/L Line Width on 3 oz. Base Copper or Greater

.012” minimum

.012” minimum

O/L Line Width on 1 oz. Base Copper or Less

.005” standard

.004”

O/L Line Width on 2 oz. Base Copper

.008” minimum

.008” minimum

O/L Line Width on 3 oz. Base Copper or Greater

.012” minimum

.012” minimum

I/L Feature to Feature on 1 oz. Base Copper or Less

.005” standard

.004”

I/L Feature to Feature on 2 oz. Base Copper

.008” minimum

.008” minimum

I/L Feature to Feature on 3 oz. Base Copper or Greater

.012” minimum

.012” minimum

O/L Feature to Feature on 1 oz. Base Copper or Less

.005” standard

.004”

O/L Feature to Feature on 2 oz. Base Copper

.008” minimum

.008” minimum

O/L Feature to Feature on 3 oz. Base Copper or Greater

.012” minimum

.012” minimum

Trace to Plane Spacing on I/L or O/L

.008” minimum

.008” minimum

Feature to Board Edge

.010” min I/L & O/L * exclude tabs

.008” min I/L & O/L * exclude tabs

Feature to Score Edge

.020” minimum

.015” minimum

 

 

 

Carbon Ink

 

 

Carbon Ink size to Copper Feature

.015” larger than feature size.

.010” larger than feature size.

Carbon Ink to Carbon Ink Spacing

.015” minimum

.013” minimum

Carbon Ink to Solder Mask

.005” minimum

.005” minimum

 

 

 

Solder Mask

 

 

LPI Conductor Overlap

.003” min over conductor edge.

.002” min over conductor edge.

LPI Mask Clearance

.006” larger than O/L feature size.

.004” larger than O/L feature size.*

LPI Mask Web* less than 4mil web may result in loss of mask between SMT pads.

.004” minimum width

.003” minimum width * Decrease clearance to 5mil, then web to 3.5mil, then clearance to 4mil, etc.

 

 

 

Nomenclature

 

 

Silk Screen Process (legend ink)

.008” minimum aperture

.006” minimum aperture

Etching Process (copper)

.010” minimum aperture

.010” minimum aperture

Font Height

.065” minimum height

.045” minimum height

Distance from Feature (clipping)

.006” min from pad, SMT, etc.

.006” min from pad, SMT, etc.

   
 
 
Blank
Sonic Sonic
© Sonic Technology. All rights reserved.