Annular Ring |
Standard |
Emerging Technologies |
Internal Minimum Pad Size |
.016” larger than finished hole size. |
.014” larger than finished hole size w/tear drop. |
External Minimum Pad Size |
.016” larger than finished hole size. |
.014” larger than finished hole size w/tear drop. |
* increase pad size accordingly for annular ring requirements greater than .001”. |
* holes requiring greater than .001” copper (i.e. 2oz. Base plated to 4oz. Finish) require an additional .004” pad diameter |
Plane Layer Clearance |
|
|
PTH & NPT hole Clearance to Plane |
.030” larger than finished hole size. |
.024” larger than finished hole size. |
PTH & NPT hole to I/L Trace |
.015” spacing |
.012” spacing |
|
|
|
Line Width & Space |
|
|
I/L Line Width on 1 oz. Base Copper or Less |
.005” standard |
.004” |
I/L Line Width on 2 oz. Base Copper |
.008” minimum |
.008” minimum |
I/L Line Width on 3 oz. Base Copper or Greater |
.012” minimum |
.012” minimum |
O/L Line Width on 1 oz. Base Copper or Less |
.005” standard |
.004” |
O/L Line Width on 2 oz. Base Copper |
.008” minimum |
.008” minimum |
O/L Line Width on 3 oz. Base Copper or Greater |
.012” minimum |
.012” minimum |
I/L Feature to Feature on 1 oz. Base Copper or Less |
.005” standard |
.004” |
I/L Feature to Feature on 2 oz. Base Copper |
.008” minimum |
.008” minimum |
I/L Feature to Feature on 3 oz. Base Copper or Greater |
.012” minimum |
.012” minimum |
O/L Feature to Feature on 1 oz. Base Copper or Less |
.005” standard |
.004” |
O/L Feature to Feature on 2 oz. Base Copper |
.008” minimum |
.008” minimum |
O/L Feature to Feature on 3 oz. Base Copper or Greater |
.012” minimum |
.012” minimum |
Trace to Plane Spacing on I/L or O/L |
.008” minimum |
.008” minimum |
Feature to Board Edge |
.010” min I/L & O/L * exclude tabs |
.008” min I/L & O/L * exclude tabs |
Feature to Score Edge |
.020” minimum |
.015” minimum |
|
|
|
Carbon Ink |
|
|
Carbon Ink size to Copper Feature |
.015” larger than feature size. |
.010” larger than feature size. |
Carbon Ink to Carbon Ink Spacing |
.015” minimum |
.013” minimum |
Carbon Ink to Solder Mask |
.005” minimum |
.005” minimum |
|
|
|
Solder Mask |
|
|
LPI Conductor Overlap |
.003” min over conductor edge. |
.002” min over conductor edge. |
LPI Mask Clearance |
.006” larger than O/L feature size. |
.004” larger than O/L feature size.* |
LPI Mask Web* less than 4mil web may result in loss of mask between SMT pads. |
.004” minimum width |
.003” minimum width * Decrease clearance to 5mil, then web to 3.5mil, then clearance to 4mil, etc. |
|
|
|
Nomenclature |
|
|
Silk Screen Process (legend ink) |
.008” minimum aperture |
.006” minimum aperture |
Etching Process (copper) |
.010” minimum aperture |
.010” minimum aperture |
Font Height |
.065” minimum height |
.045” minimum height |
Distance from Feature (clipping) |
.006” min from pad, SMT, etc. |
.006” min from pad, SMT, etc. |
