| B |
| BABT |
British Approval Board for Telecommunications: BABT certifies products and services in the fields of IT and telecom. |
| BALL-GRID ARRAY (BGA) |
A flip-chip type of package in which the internal die terminals form a grid-style array, and are in contact with solder balls (solder bumps), which carry the electrical connection to the outside of the package. |
| BASE COPPER |
Copper foil provided in sheet form or clad to one or both sides of the laminate to be used as either internal or external layers of a circuit board. |
| BASE LAMINATE |
The dielectric material upon which the conductive pattern is formed. |
| BBT |
Bare Board Test |
| BED-OF-NAILS |
Test method that uses an array of contact pins to test components. |
| BILL OF MATERIALS (BOM) |
The source of information for all components of an assembly. |
| BOARD |
Short for printed circuit board. |
| BUILD-TO-ORDER SYSTEMS ASSEMBLY |
Build significant volume of units based on forecast, typically a base unit or standard configuration. Ship to either OEM warehouse or distribution warehouse. |
