H |
HASL |
Hot-Air-Solder-Level |
HAZ |
Heat-affected zone |
HDI |
High-density interconnect |
HEIJUNKA |
The creation of a “level schedule” by sequencing orders in a repetitive pattern and smoothing the day-to-day variations in total orders to correspond to longer-term demand. |
HOLE DENSITY |
The quantity of holes in a printed circuit board per unit area. |
HOLEWALL |
The vertical surface of a drilled hole of a printed circuit board. |
HPGL |
Hewitt-Packard Graphics Language, a text-based data structure of pen-plot files which are used to drive Hewlett-Packard pen plotters. |
HSP |
Host signal processing. |
HYBRID |
Hybrid circuit. Any circuit made by using a combination of the following component manufacturing technologies: monolithic IC, thin film, thick film and discrete component. |