| H |
| HASL |
Hot-Air-Solder-Level |
| HAZ |
Heat-affected zone |
| HDI |
High-density interconnect |
| HEIJUNKA |
The creation of a “level schedule” by sequencing orders in a repetitive pattern and smoothing the day-to-day variations in total orders to correspond to longer-term demand. |
| HOLE DENSITY |
The quantity of holes in a printed circuit board per unit area. |
| HOLEWALL |
The vertical surface of a drilled hole of a printed circuit board. |
| HPGL |
Hewitt-Packard Graphics Language, a text-based data structure of pen-plot files which are used to drive Hewlett-Packard pen plotters. |
| HSP |
Host signal processing. |
| HYBRID |
Hybrid circuit. Any circuit made by using a combination of the following component manufacturing technologies: monolithic IC, thin film, thick film and discrete component. |
