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HASL Hot-Air-Solder-Level
HAZ Heat-affected zone
HDI High-density interconnect
HEIJUNKA The creation of a “level schedule” by sequencing orders in a repetitive pattern and smoothing the day-to-day variations in total orders to correspond to longer-term demand.
HOLE DENSITY The quantity of holes in a printed circuit board per unit area.
HOLEWALL The vertical surface of a drilled hole of a printed circuit board.
HPGL Hewitt-Packard Graphics Language, a text-based data structure of pen-plot files which are used to drive Hewlett-Packard pen plotters.
HSP Host signal processing.
HYBRID Hybrid circuit. Any circuit made by using a combination of the following component manufacturing technologies: monolithic IC, thin film, thick film and discrete component.
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