Our circuit board manufacturing process adheres to the following attributes:
- Max board/array size – 16” x 22”
- Maximum number of layers – 18
- Controlled impedance – +/- 10%
- Standard and High Temp FR4 laminates
- Overall thickness – .015” -.125”
- Copper weight – UL approved to 4oz. finish
- Panel separation either rout or score or combination of both
- High performance materials including Rogers 4003 and 4350