We follow a multilayer pcb manufacturing process that insures quality while offering flexibility.

This Flow Chart is typical for most Multilayer product, higher layer counts require duplication of Inner Layer Processes for each core. Double Sided boards begin at Copper Clad Laminate (as Layer 1 & 2) followed by Drill & Deburr Holes. Blind Vias, Buried Vias, Filled Vias and other higher technologies use these same processes in differing sequences while being augmented by additional specialty processes such as Planerization, Laser Drilling, Controlled Depth Drilling, etc.