We understand that the jargon and terms we use to describe pcb fabrication and manufacturing can be confusing. We’ve prepared a comprehensive glossary to make the job a little easier.
ACF
Anisotropic conductive film
ACTIVE COMPONENT
A component which adds energy to the signal it passes, e.g., transistors, rectifiers, diode, amplifiers, oscillators, mechanical relays and almost all IC’s.
AEA
American Electronics Association.
ALKALINE
A chemical that measures over 7 on a pH scale.
ANALOG CIRCUIT
A circuit in which the output varies as a continuous function of the input, as opposed to a digital circuit.
ANDON BOARD
A lighted overhead electronic display that gives the current status of the production system and alerts team members to emerging problems.
ANNULAR RING
The copper ring around the hole in a printed wiring board
AOI
Automate Optical Inspection
AOT
Automated optical test
APERTURE
An indexed shape with a specified x and y dimension, or line-type with a specified width, used as a basic element or object by a photoplotter in plotting geometric patterns on film. The index of the aperture is its position or D code.
APERTURE LIST
An ASCII text data file which describes the size and shape of the apertures used by a photoplotter for any one photoplot.
APICS
American Production and Inventory Control Society.
APPROVED VENDOR LIST (AVL)
Parts list specifying the approved manufacturer and part number.
AQL
Acceptable Quality Level
ARRAY
A group of printed circuits (called modules) arrayed in a panel and handled by both the board house and the assembly house as though it were a single printed wiring board.
ARTWORK
Artwork for printed circuit design is photoplotted film, NC Drill File and documentation which are all used by a board house to manufacture a bare PWB.
ASCII
American Standard Code for Information Interchange. ASCII is the basis of character sets used in almost all present-day computers.
ASIC
Application-Specific Integrated Circuit
ASIC DESIGN
Ability to design an application specific integrated circuit (ASIC) chip. An ASIC chip is custom designed for a specific application, in contrast to a general-purpose chip such as a microprocessor.
ASPECT RATIO
The ratio of the circuit board thickness to the diameter of the smallest drilled hole
ATE
Automated Test Equipment
ATG
Automated Test Generation
AUTO-INSERTION (AI)
A method/equipment used to insert pin-through-hole components to printed wiring boards (PWB’s).
AXI
Automatic X-ray Inspection
British Approval Board for Telecommunications: BABT certifies products and services in the fields of IT and telecom.
A flip-chip type of package in which the internal die terminals form a grid-style array, and are in contact with solder balls (solder bumps), which carry the electrical connection to the outside of the package.
Copper foil provided in sheet form or clad to one or both sides of the laminate to be used as either internal or external layers of a circuit board.
The dielectric material upon which the conductive pattern is formed.
Bare Board Test
Test method that uses an array of contact pins to test components.
The source of information for all components of an assembly.
Short for printed circuit board.
Build significant volume of units based on forecast, typically a base unit or standard configuration. Ship to either OEM warehouse or distribution warehouse.
Capacitance
Computer-aided design. A system where designers create a design and see the proposed product in front of them on a computer monitor.
Computer Aided Engineering
Conductive Anodic Filamentation (or Conductive Anodic Filament growth). An electrical short which occurs in PWB’s when a conductive filament forms in the laminate dielectric material between two adjacent conductors under an electrical bias.
Computer Aided Manufacturing
Another name for a printed wiring board.
A connector which is fabricated as an integral portion of a printed wiring board along an edge(s). Often employed to enable a daughter or add-on card to be plugged directly into another much larger printed board, the motherboard or backplane.
Ceramic Ball Grid Array.
A NEMA grade of industrial laminate having a substrate of woven glass surfaces over a cellulose paper core and a resin binder of epoxy.
The nominal distance between the centers of adjacent features or traces on any layer of a printed circuit board. Also referred to as ‘pitch’.
Column grid array
When the channel, such as distributors, dealer or VARs, performs BTO or CTO functions themselves or outsource the manufacturing function.
A compound measurement of the resistance, inductance, conductance and capacitance of a transmission line expressed in ohms.
Pen plots that are suitable for checking only.
An integrated circuit manufactured on a semiconductor substrate and then cut or etched away from the silicon wafer.
A chip package in which the total package size is no more than 20% greater than the size of the die within.
A method of affixing unencapsulated integrated circuits onto a printed wiring board using a wire bonding process.
Computer Integrated Manufacturing
Ability to design the circuit logic that allows electronic components to perform a specific function.
Complementary metal-oxide semiconductor
Computer Numerical Control.
Introduced by Sandisk in 1994. One-fourth the size of a PC card, 36 mm long, 43 mm wide and 3.3 mm thick. ATA interface. Uses 50 pins. Takes a passive adapter to use it in a PC card slot.
Compact PCI is a modern, very high performance and robust industrial bus based on the standard PCI electrical specification.
Ability to assemble and test systems that involve large scale assembly, integration, staging and product support; that require extensive testing and configuration; have high part counts/complex BOM management require engineering changes and accelerated testing (e.g. HASS, power cycling).
The service of applying engineering know-how to the processes of component selection, application and procurement. Can provide analysis of new trends in electronic devices.
A hole used for the attachment and electrical connection of component terminations, including pins and wires, to the printed circuit board.
A thin conductive area on a printed circuit board surface of internal layer usually composed of lands and traces.
Takes an already built or partially built unit and adds specific peripherals and software for individual customer order. Ship direct to customer.
An impurity or foreign substance whose presence on printed circuit assemblies could electrolytically, chemically, or galvanically corrode the system.
The practice of making products or subcomponents of products to be sold under a different company’s name.
The period in the reflow process after peak temperature when the temperature drops to the point where the solder joints fuse or solidify.
The copper foil laminated fiberglass panel that printed circuit boards are built upon. Also known as substrate panel or interlayer.
Those functions or practices deemed by a company as central to its existence. Those activities that the company believes it does best, should focus on and that are in the company’s best interest for long-term success and growth.
Central Processor Unit
Chip Scale
C-mode scanning acoustic microscopy
Chip-scale package
Coefficient of thermal expansion
The ability to add accessory and FRU items, unique to the customer order, for end distribution. This could involve adding promotional items, country-specific kits for accessories including keyboards, power cords and literature, and shipping to the customer in a wide assortment of end-packaging requirements.
A datum in a Gerber file which acts as a command to a photoplotter/laser plotter.
Department of Advanced Research Projects Agency
Direct Chip Attach
Provides a process that subjects a design to a series of stress tests to determine its robustness.
Removal of epoxy smear (melted resin) and drilling debris from a hole wall.
Design For Assembly
Design For Manufacturability
De-ionized Water
Design for test
Dicyandiamide, the most common cross-linking agent used in FR-4.
The ratio of the capacitance of a capacitor with the given dielectric to the capacitance of a capacitor having air for its dielectric but otherwise identical.
A circuit which operates like a switch (it is either “on or “off”), and can make logical decisions.
Dual In-Line Memory Module: a small circuit board that holds memory chips a single in-line memory module (SIMM) has a 32-bit path to the memory chips whereas a DIMM has 64-bit path. Because the Pentium processor requires a 64-bit path to memory, you need to install SIMMs two at a time. With DIMM’s, you can install memory one DIMM at a time.
Dual In-Line Package. A type of housing for integrated circuits.
Dimethylamine Borane
A supplier quality management practice that allows a component or product to enter into a company without going through an incoming inspection upon arrival at the receiving dock.
Disk Operating System
Slang for designs with two traces between DIP pins, hole centers.
Dynamic Random Access Memory: a type of memory used in most personal computers.
Design Rule Check
A solder mask film applied to a printed board with photographic methods.
Double-treated foil
Digital signal processor
Device Under Test. A DUT board is used in automated testing of integrated circuits
Dense wave division multiplexer
Electronic Components, Assemblies & Materials Association
Electro Deposited
Erbium-doped fiber amplifier
Electronic data exchange
Extended Data Out Dram. A DRAM that holds the data on the system memory bus until the beginning of the next cycle. Named to distinguish it from FPM DRAM which removes the data from the memory bus before the completion of the cycle
Energy dispersive X-ray
A chemical deposition process where copper is deposited onto an outerlayer panel without an electrolytic source.
The electronic transfer of data over a network.
The industry based on providing manufacturing services for electronics OEMs.
End-of-Life Vehicle
A system that is located entirely on a processor. All logic is contained in a single chip.
ElectroMagnetic Compatibility
ElectroMagnetic Interferance
Electronics manufacturing services
Generally involves the support of low volume new build to support service demand where the return rates from service do not support the service demand rate. Will involve BOM management, AVL management , material recovery, order management, manufacturing tool archives.
A packaged application that enables a company to automate almost every aspect of its operations by tying its ERP databases to its intranet and extranet and allowing full browser access to them.
Electroless nickel, immersion gold.
A process by which components or assemblies are tested at the extremes of their normal operating conditions, usually in terms of temperature and voltage limits, for a period of hours or days in order to detect early life defects. It is not meant to be a destructive test.
“Engineering-pad.” A plated-through hole or surface mount pad on a PWB placed on the board for the purpose of attaching a wire by soldering.
Electrostatic discharge
Transfer efficiency
The rate at which the solution attacks or etches a surface.
European Union
A drawing used to aid the construction of a printed wiring board.
FRU exchange, ECO upgrade, NTF , test, field ready pack out, advanced exchange, direct ship, FGI management.
Flip chip
Flip chip in package
Frequency Domain Reflectometry
Field effect transistor
Flying Head Probe
Refers to chip packages with lead pitches below 1.27mm.
A gold-plated terminal of a card-edge connector.
A sample part or assembly manufactured prior to the start of production for the purpose of ensuring that the manufacturer is capable of manufacturing a product which will meet the requirements.
Five Japanese-language terms used to create a workplace suited for visual control and Lean production. Seri means to separate needed tools, parts and instruction from unneeded materials and to remove the latter. Seiton means to neatly arrange and identify parts and tools for ease of use. Seiso means to conduct a cleanup campaign. Seiketsu means to conduct the first three S’s at frequent intervals to keep a workplace in perfect condition. Shitsuke means to form the habit of following the first four S’s.
Second-level integration of active and or passive devices on a flexible, formable substrate.
An array of conductors bonded to a thin, flexible dielectric.
A mounting approach in which the chip is inverted and connected directly to the substrate rather than using the more common wire bonding technique.
A substance used to promote or facilitate fusion such as a material used to remove oxides from surfaces to be joined by soldering or welding.
Fiber optic
The pattern and space on a board taken up by a component.
Flexible Printed Circuit
Flat Panel Display
A lower grade version of FR-2
A NEMA grade of Flame-Retardant industrial laminate having a substrate of paper and resin binder of phenolic.
A NEMA grade of Flame-Retardant industrial laminate having a substrate of woven-glass fabric and resin binder of epoxy
Fire-Retardant glass-and-polyester substrate material for electronic circuits.
Fourier transform infrared spectroscopy
A process that supplies a finished manufactured product directly from a manufacturing facility to a distributor or end user without the finished product going back through the company that has created the product. The fulfillment cycle may include receiving customer orders, configuring the products to order, shipping and invoicing products to distribution outlets or end users around the world
Data file used to control a photoplotter. Named after Gerber Scientific Co., who made the original vector photoplotter.
Global Systems for Mobile (communications): one of the leading digital cellular systems. GSM uses narrow band TDMA, which allows eight simultaneous calls on the same radio frequency.
Hot-Air-Solder-Level
Heat-affected zone
High-density interconnect
The creation of a “level schedule” by sequencing orders in a repetitive pattern and smoothing the day-to-day variations in total orders to correspond to longer-term demand.
The creation of a “level schedule” by sequencing orders in a repetitive pattern and smoothing the day-to-day variations in total orders to correspond to longer-term demand.
The quantity of holes in a printed circuit board per unit area.
The vertical surface of a drilled hole of a printed circuit board.
Hewitt-Packard Graphics Language, a text-based data structure of pen-plot files which are used to drive Hewlett-Packard pen plotters.
Host signal processing.
Hybrid circuit. Any circuit made by using a combination of the following component manufacturing technologies: monolithic IC, thin film, thick film and discrete component.
Input/Output
Input/Output devices: whose purpose is to enter data into a computer or to extract data from a computer. For example, a modem is an I/O device, whereas CPU is a computational device.
Integrated circuit
In Circuit Test
The copper foil laminated fiberglass panel that printed circuit boards are built upon. Also known as a substrate, panel or core.
A built-in inspection function in the manufacturing process.
Service of assisting or advising customer in the areas of: selecting the appropriate packaging and materials, design tradeoffs in board wiring and spacing densities, and determining internal wiring and components usage based on performance, reliability, manufacturing and cost considerations.
Intellectual property
Association Connection Electronics Industries, formerly, The Institute for Interconnecting and Packaging Electronic Circuits.
Infrared
Industry standard architecture. Older standard also used to be commonly used in PCs.
International Standards Organization
Integrated Services Digital Network: an international communications standard for sending voice, video, and data over digital telephone lines or normal telephone wires. ISDN supports data transfer rates of 64 Kbps (64,000 bits per second). Most ISDN lines offered by telephone companies give you two lines at once, called B Channels. You can use one line for voice and the other for data, or you can use both lines for data to give you data rates of 128 Kbps, three times the data rate provided by today’s fastest modems.
Continuous, incremental improvements of an activity to create more value with less waste.
A small card attached to boxes of parts that regulates pull by signaling upstream production and delivery.
Known good die
Gathering parts into kits for production assembly.
Thickness of the base material, not including metal-clad, prior to any processing. Applies to single, or double-sided material.
The application of a photoresist to a printed circuit board through the use of heat, pressure and time.
A portion of a conductive pattern usually, but not exclusively, used for the connection and/or attachment of components. Also called ‘pad’.
Landline is a term used by wireless system operators to refer to the regular telephone network. Sometimes called the wired network, but because the wireline cellular phone usually operates the wired phone network, the term landline is preferred.
A terminal on a component
The Toa time a customer must wait to receive a product after placing an order.
Land grid array
Manages the reverse flow of defective product from the end user through the various steps to repair and then back out to the end user. Will involve inventory management, remote stocking location management/re-provision, reverse logistics, advanced exchange, warehousing, external shipping/receiving, freight carrier management, scheduling, forecasting, import/export, freight data collection, turnaround time metrics.
Logistics involves the sorting, warehousing and shipping of raw goods and finished product. Distribution management focuses on direct shipment to the end user.
Laser particle guidance
Liquid Photoimageable Solder Mask: A mask sprayed on using photographic imaging techniques to control deposition.
Large scale integration
Localizable stick-together
Low-temperature co-fired ceramic
The flared condition of copper on the inner conductor layers of a multilayer board caused by hole drilling.
Numeric Control drill machine. A machine used to drill the holes in a printed wiring board at exact locations, which are specified in a data file.
A text file which tells an NC drill where to drill its holes.
National Electrical Manufacturers Association
A collection of terminals all of which are, or must be, connected to each other electrically.
List of names of symbols or parts and their connection points which are logically connected in each net of a circuit.
Provides a business process to help the customer achieve a cost-effective quick-to-volume production design. The process is most effective when the customer engages at the concept phase of the product’s development cycle. It can include technology selection, design, test and material strategies, DFX, Component, design and development engineer services and rapid board and system proto build services.
A pin or lead which will have at least one wire connected to it.
The measure of free acid in a solution. A pH of 7 would be considered normal
Optoelectronic
Open circuit. An unwanted break in the continuity of an electrical circuit which prevents current from flowing.
A business model/product manufacturing method where a product is designed and assembly is performed upon receipt of functional requirements for a type of product. In the typical ODM model, the manufacturer designs the complete product. In other cases, the ODM may rely on a combination of original design capabilities for some assemblies/components and off-the-shelf components and assemblies to meet the customer requirements. This allows for the greatest level of customization and product differentiation.
The company behind the “brand name” of a product.
Organic Solderability Preservative
The practice of subcontracting.
A chemical treatment to inner layers prior to lamination, for the purpose of increasing the roughness of clad copper to improve laminate bond strength.
The portion of the conductive pattern on printed circuit boards designated for the mounting or attachment of components. Also called ‘land’.
The copper foil laminated fiberglass panel that printed circuit boards are built upon. Also known as substrate interlayer or core.
Serial number tracking, EC management, parts exchange, configuration management, FGI levels, secondary channel sales, parts sale/restocking, advanced sales, sub-contract repair management.
A device which does not add energy to the signal it passes, e.g., resistros, capacitors, and inductors.
Plastic ball grid array
Personal Computer: A computer device packaged in a small card about the size of a credit card and conforming to the PCMCIA standard.
Printed circuit board. A flat plate or base of insulation material containing a pattern of conduction material.
Poly Chlorinated Biphenyl compounds
Peripheral Component Interconnect: a local bus standard developed by Intel Corporation. Most modern PCs include a PCI bus in addition to a more general ISA expansion bus. Many analysts, however, believe that PCI will eventually supplant ISA entirely.
Pulse code Modulation: a sampling technique for digitizing analog signals, especially audio signals. PCM is used with T-1 and T-3 carrier systems. These carrier systems combine the PCM signal from many lines and transmit them over a single cable or other medium.
Personal Computer Memory Card International Association.
Personal digital assistant
A test performed to determine the adhesion strength of bonded materials to the printed circuit board.
Pin grid array
Polyimide
A terminal on a through-hole component.
A minute hole through a layer or pattern.
The dissolution of oxide near a drilled hole causing a “pinkish” discoloration of the copper.
A method of soldering electrical components to a board substrate that involves pin-through-hole connections.
The nominal distance between the centers of adjacent features or traces on any layer of a printed circuit board. Also referred to as ‘center-to-center spacing’.
Material over conductive areas used to prevent the plating of the covered areas.
Plastic Leaded Chip Carrier. An SMT chip package that is rectangular or square-shaped with leads on all four sides.
Normalized bumping performance
To unite chemically two or more monomers or polymers to form a molecule with a higher molecular weight.
Plastic Quad Flat Pack
A fiberglass cloth impregnated with resin used in multilayer lamination. Also known as B-Stage Material.
A circuit for electronic apparatus made by depositing conductive material in continuous paths from terminal to terminal on an insulating surface.
The process of transforming the electrical design (functional or logical representation) into a physical object (physical layout of placing components and routing of interconnect wires).
Second-level integration of active and passive devices (electrical, electronic, optical and/or mechanical) on a rigid substrate.
Tailoring or building manufacturing methods for technology mix elected by customer.
Plated-through-hole. A hole in a PWB with the metal plating added after it is drilled.
A system that eliminates the primary source of waste-overproduction-by producing only what customers want, when they want it. This means starting production only when the customer pulls.
Printed wiring board.
Printed Wiring Board Assembly.
Resin-coated copper
Resin-coated foil
Rambus DRAM: a type of memory (DRAM) developed by Rambus, Inc. Whereas the fastest current memory technologies used by PCs (SDRAM) can deliver data at a maximum speed of about 100 MHz, RDRAM transfers data at up to 600 MHz.
Upgrading an existing product by replacing subsystems, peripherals, software or cabling.
A process to form a solder joint by providing heat to the solder paste.
Capability to determine the root cause of a component or assembly defect or failure as well as to predict the “life” of a board or system. This is usually expressed in terms of “mean time between failures” (MTBF).
Repair, refurbishment, remanufacturing, upgrades, test and burn-in, component debug, field ready pack out, direct ship, RMA control, advanced exchange, DGI management, EC management, data recovery, failure analysis, material recovery.
Receiving/parts ID, warranty validation, variance resolution, NTF screen, re-box/re-stock, route to repair/upgrade, scrap/re-cycle.
Radio Frequency
Ability to do circuit designs that operate in a range of electromagnetic frequencies above the audio range and below visible light. All broadcast transmission, from AM radio to satellites, falls into this range, which is between 30KHz and 300 GHz.
Radio-frequency integrated circuit
Relative Humidity
Rambus In-Line Memory Module: This is the form factor for Rambus RDRAM. By comparison, SDRAM is mainly found on DIMM’s, and EDO RAM is usually on SIMMs. RIMM’s require that if you don not fill all RIM slots with RDRAM memory, you must keep the empty slots filled with termination boards to ensure that the high speed Rambus memory signals do not bounce improperly.
Part of the European Union Directive 2002/95/EC1. This Directive on the “Restriction on the use of certain Hazardous Substances in electrical and electronic equipment”. This directive takes effect July 1, 2006 and bans the use of lead, chromium, mercury, polybriminated biphenyl’s, cadmium and polybrominated diphenyl ethers.
Return On Investment
A layout or wiring of a connection Reverse Treated Foil
Sequential build-up
A diagram which shows, by means of graphic symbols, the electrical connections, components and functions of an electrical system.
Synchronous Dynamic Random Access Memory: a new type of DRAM that can run at much higher clock speeds than conventional memory. SDRAM actually synchronizes itself with the CPU’s bus and is capable of running at 100 MHz, about three ties faster than conventional FPM RAM, and about twice as fast as EDO DRAM and BEDO DRAM. SDRAM is replacing EDO DRAM in many newer computers.
A chemical solution that will not continue a reaction with the panel once a limit has been reached.
Scanning electron microscope
Semiconductor Industry Association
Short circuit. An abnormal connection of relatively low resistance between two points of a circuit.
Semiconductor Industry Association
A net other than a power or ground.
A thin, iridescent, silvery disk of silicon which contains a set of integrated circuits, prior to their being cut free and packaged.
The decals and reference designators in epoxy ink on a printed wiring board.
Single-In-Line Memory Module: a small circuit board that holds memory chips. A single in-line memory module (SIMM) has a 32-bit path to the memory chips.
Secondary ion mass spectroscopy
Board technology whereby one track is designed between hole-centers on a DIP.
System in package
System-level integration
A protective sheet placed between innerlayers during transport to limit board-to-board contact and scratching.
Surface Mount Device, or, Solder-mask defined.
Society of Manufacturing Engineers
Solder Mask Over Bare Copper
Surface Mount Technology.
Small Outline Dual In-Line Memory Module: a small version of a DIMM used commonly in notebook computers. Whereas a full-size DIMM has 168 pins and can support 64-bit transfers, and SO DIMM has only 72 pins and can support only 32-bit transfers. In this respect, it is more like a SIMM, except that it is smaller.
Small-outline integrated circuits
Small-Outline J-lead, a type of chip module that uses J-shaped pins that extend inwards. Unlike DIPS, which plug into holes on the circuit board, and SOJ chip attaches directly to the circuit board’s surface.
The round solder balls bonded to a transistor contact area and used to make connection to a conductor by face-down bonding techniques.
Solder balls
A technique wherein everything on a circuit board is coated with a non-conductive polymer except the contacts to be soldered, the edge-card connectors and fiducials.
Statistical Process Control.
Shrink Quad Flat Pack
Static Random Access Memory: a type of memory that is faster and more reliable than the more common DRAM (dynamic RAM). The term static is derived from the fact that it doesn’t need to be refreshed like dynamic RAM.
Surface Square Foot.
The appearance of copper spotting on the surface of an interlayer
CPU architecture oriented to embedded low-end requirements originally designed by ARM (a UK based company) but now manufactured under license by Intel and some others.
A group of printed circuits (called modules) arrayed in a panel and handled by both the board house and the assembly house as though it were a single printed wiring board.
The copper foil laminated fiberglass panel that printed circuit boards are built upon. Also known as an interlayer, panel or core.
Supply chain management is the ability to ensure a steady flow of materials through the manufacturing process. Logistics management involves the sorting, warehousing, and shipping raw goods and finished products.
The measurement of insulation resistance across the surface of an insulation material.
Surface mount technology. The technology of creating printed wiring wherein components are soldered to the board without using holes. The result is higher component density, allowing for smaller PWB’s.
A method of soldering electrical components directly to a board substrate that uses less space than the pin-through-hole method.
The physical appearance characterized by either being porous or non-porous.
Ability to do designs that comprise the interaction and integration of various sub-assemblies into a single assembly to accomplish an intended function. The sub-assemblies can consist of electrical, mechanical, optical, software, acoustical and other components to achieve overall functionality. Examples of systems design include designing a PC, a cellular phone or a pager.
Combining sub-systems an/or peripherals, adding software and cabling to specification in order to produce fully configured product.
Underwriter’s Laboratories, Inc.. A corporation supported by some underwriters for the pupose of establishing safety standards on types of equipment or components.
The 7-bit version of ASCII.
The specific activities required to design, order and provide a specific product-from concept to launch, order to delivery.
A name for a power net, meaning “voltage collector”.
Vertical cavity surface-emitting laser
A name for a power net, meaning “voltage drain”.
The supplier provides not only the materials, but directly or indirectly, is responsible for managing and replenishing inventory.
Feed-through. A plated-through hole in a PWB used to route a trace virtically in the board, that is, from one layer to another.
Very Large Scale Integration
Small holes found in plated through holes that may result in a defect if found in a high enough number.
Waste Electronics and Electrical Equipment
Work in process.
The method used to attach very fine wire to semiconductor components to interconnect these components with each other or with package leads. The wires might be 1 to 2 mils in diameter and made fo aluminum containing 1% silicon.
Wafer-level chip-scale package
No Data Found
YIELD
A percentage used to measure the number of successful products to the number of scrapped products. This is a common way of determining the success rate of a production line.