We strive for seamlessness in our two printed circuit board manufacturing facilities, but there are some distinctions in process capability between our Rolling Meadows facility and our India facility
| Sonic Tech. (India), Inc. | National Technology, Inc. | |
|---|---|---|
| FACILITIES | 125,000 Square Feet | 56,500 Square Feet |
| Inner Layer Trace/Space | .004/”.004″ | .003″/.003″ |
| Outer Layer Trace/Space | .004/”.004″ | .003″/.003″ |
| Minimum Drilled Hole | .010″ | .010″ |
| Number of Layers | 1-18 Layers | 1-18 Layers |
| Minimum SMT Pitch | 16 mil | 10 mil |
| Layer to Layer Registration | +/-.005″ | +/-.005″ |
| Soldermask Registration | LPI +/-.0025″ | LPI +/-.0025″ |
| Feature to Feature Registration | +/-.003″ | +/-.003″ |
| Maximum Finished Board Size | 16 x 22 | 16 x 22 |
| Board Thickness Tolerance | +/-.005″ (.062) | +/-.005″ (.062) |
| Board Flatness Tolerance | .007 (in./in.) | .007 (in./in.) |
| HASL | Yes | Yes |
| LF/HASL | Yes | Yes |
| ENIG Capability | Yes | Yes |
| Immersion Silver Capability | Yes | Yes |
| Electrical Test Capability | Netlist Test – Grid and Flying Probe | Netlist Test – Grid and Flying Probe |
| Laser Photo Plotting | In House | In House |
| AOI Capability | Yes | Yes |
| Controlled Impedance | Yes | Yes |
| Blind/Buried Via’s | N/A | Blind/Buried |
| UL Line Approval | .004″ Line/Space | .004″ Line/Space |
| Military Approval | N/A | N/A |
| ISO Certified | Yes; ISO-9001:2015 | Yes; ISO-9001:2015 |
| ITAR Certified | No | Yes |