We strive for seamlessness in our two printed circuit board manufacturing facilities, but there are some distinctions in process capability between our Rolling Meadows facility and our India facility

Sonic Tech. (India), Inc.National Technology, Inc.
FACILITIES125,000 Square Feet56,500 Square Feet
Inner Layer Trace/Space.004/”.004″.003″/.003″
Outer Layer
Trace/Space
.004/”.004″.003″/.003″
Minimum Drilled Hole .010″.010″
Number of Layers1-18 Layers1-18 Layers
Minimum SMT Pitch16 mil10 mil
Layer to Layer Registration+/-.005″+/-.005″
Soldermask RegistrationLPI +/-.0025″LPI +/-.0025″
Feature to Feature Registration+/-.003″+/-.003″
Maximum Finished Board Size16 x 2216 x 22
Board Thickness Tolerance +/-.005″ (.062) +/-.005″ (.062)
Board Flatness Tolerance .007 (in./in.).007 (in./in.)
HASLYesYes
LF/HASLYesYes
ENIG CapabilityYesYes
Immersion Silver CapabilityYesYes
Electrical Test CapabilityNetlist Test – Grid and Flying ProbeNetlist Test – Grid and Flying Probe
Laser Photo PlottingIn HouseIn House
AOI Capability YesYes
Controlled ImpedanceYesYes
Blind/Buried Via’sN/ABlind/Buried
UL Line Approval.004″ Line/Space.004″ Line/Space
Military ApprovalN/AN/A
ISO CertifiedYes; ISO-9001:2015Yes; ISO-9001:2015
ITAR CertifiedNoYes