Sonic Technology India INC – Printed Circuit Board Manufacturing Capabilities

Sonic Tech. (India), Inc.
FACILITIES125,000 Square Feet
Inner Layer Trace/Space.004/”.004″
Minimum Drilled Hole .010″
Number of Layers1-18 Layers
Minimum SMT Pitch16 mil
Layer to Layer Registration+/-.005″
Soldermask RegistrationLPI +/-.0025″
Feature to Feature Registration+/-.003″
Maximum Finished Board Thickness16 x 22
Board Thickness Tolerance +/-.005″ (.062)
Board Flatness Tolerance .007 (in./in.)
HASLYes
LF/HASLYes
ENIG CapabilityYes
Immersion Silver CapabilityYes
Electrical Test CapabilityNetlist Test – Grid and Flying Probe
Laser Photo PlottingIn House
AOI Capability Yes
Controlled ImpedanceYes
Blind/Buried Via’sN/A
UL Line Approval.003″ Line/Space
Military ApprovalN/A
ISO CertifiedYes; ISO-9001:2015
ITAR CertifiedNo