TECHNICAL CAPABILITIES Sonic Technology India INC – Printed Circuit Board Manufacturing Capabilities Show 10252650100 entriesSearch: Sonic Tech. (India), Inc. FACILITIES125,000 Square Feet Inner Layer Trace/Space.004/”.004″ Minimum Drilled Hole .010″ Number of Layers1-18 Layers Minimum SMT Pitch16 mil Layer to Layer Registration+/-.005″ Soldermask RegistrationLPI +/-.0025″ Feature to Feature Registration+/-.003″ Maximum Finished Board Thickness16 x 22 Board Thickness Tolerance +/-.005″ (.062) Board Flatness Tolerance .007 (in./in.) HASLYes LF/HASLYes ENIG CapabilityYes Immersion Silver CapabilityYes Electrical Test CapabilityNetlist Test – Grid and Flying Probe Laser Photo PlottingIn House AOI Capability Yes Controlled ImpedanceYes Blind/Buried Via’sN/A UL Line Approval.003″ Line/Space Military ApprovalN/A ISO CertifiedYes; ISO-9001:2015 ITAR CertifiedNo Showing 1 to 24 of 24 entriesPreviousNext
